Chair of Electronic Packaging Technology
Organisational unit: Chair
Related content and researchers (public profile)
- Research output
- Journals
Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned Wafer
Singh, P. K., Machani, K. V., Breuer, D., Hecker, M., Meier, K., Kuechenmeister, F., Wieland, M., & 1 othersBock, K., 19 Apr 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-10 10 p. 10100826Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling
Dudash, V., Machani, K. V., Boehme, B., Capecchi, S., Ok, J., Meier, K., Kuechenmeister, F., & 2 othersWieland, M. & Bock, K., 30 Mar 2023, 2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings. IEEE, p. 1-6 6 p. 10117636. (IEEE International Reliability Physics Symposium Proceedings).Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Feasibility Investigation of Machine Learning for Electronic Reliability Analysis using FEA
Höhne, R., Albrecht, O., Yichen, Q., Meier, K. & Bock, K., 2023, Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc., p. 1181-1186 6 p. (Proceedings - Electronic Components and Technology Conference, Vol. 2023-May).Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Improving the Vibration Reliability of SAC Flip-Chip Interconnects Using Underfill
Höhne, R., Meier, K., Reim, M., Lehmann, M. & Bock, K. H., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers Inc., (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)).Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line
Singh, P. K., Muller, M., MacHani, K. V., Breuer, D., Hecker, M., Meier, K., Kuechenmeister, F., & 2 othersWieland, M. & Bock, K., 2023, 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM). Institute of Electrical and Electronics Engineers Inc., (IEEE International Conference on Interconnect Technology).Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Measurement + control : the journal of the Institute of Measurement and Control
ISSNs: 0020-2940
Additional searchable ISSN (Electronic): 2051-8730
Sage, London [u.a.], United Kingdom
Scopus rating (2019): CiteScore 1 SJR 0.208 SNIP 0.741
Indexed in DOAJ
Journal
Advanced packaging : an IHS Group publication
ISSNs: 1065-0555
Additional searchable ISSN (Electronic): 1065-0555
IHS Publ. Group, United States
Journal
Organic Optoelectronics and Photonics III
ISSNs: 0277-786X, 0361-0748
SPIE - The international society for optics and photonics, Bellingham, United States
Scopus rating (2022): CiteScore 0.7 SJR 0.166 SNIP 0.235
Journal: Book series
Journal of Microelectronics and Electronic Packaging
ISSNs: 1551-4897
Additional searchable ISSN (Electronic): 1551-4897
IMAPS-International Microelectronics and Packaging Society, United States
Scopus rating (2022): CiteScore 1.4 SJR 0.205 SNIP 0.347
Journal