Chair of Electronic Packaging Technology
Organisational unit: Chair
Organisation profile
Chair Holder: Prof. Dr.-Ing. Dr. h. c. Karlheinz Bock
Contact
- TUD website: https://www.avt.et.tu-dresden.de/en/
Related content and researchers (public profile)
- Research output
- Journals
- Activities
Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration
Bickel, S., Quednau, S., Birlem, O., Graff, A., Altmann, F., Junghähnel, M. & Panchenko, J., Aug 2024, In: Journal of electronic materials. 53, 8, p. 4410-4420 11 p.Research output: Contribution to journal › Research article › Contributed › peer-review
Microprinting process development enabling cost effective, high density and flexible electro-optical integration
Nieweglowski, K., Weyers, D., Mistry, A. & Bock, K., 31 May 2024, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC). IEEE, p. 1790-1796 7 p. 10565288Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Analysis of Electronic Modules for Construction Machines and Development of a Reliability Test Method
Häusler, M., Meier, K. & Bock, K., 19 May 2024, 2024 47th International Spring Seminar on Electronics Technology (ISSE). IEEE, Vol. 2024. p. 1-5 5 p. 10603578Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Development of Computationally Efficient Numerical Models for Assessing the Reliability of Electronic Components under Vibration Loads
Lyu, C., Meier, K. & Bock, K., 19 May 2024, 2024 47th International Spring Seminar on Electronics Technology (ISSE). IEEE, Vol. 2024. p. 1-6 6 p. 10603965Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Evaluation of semipermeable membranes for encapsulating gas sensors in human intestinal environments
Stadermann, F., Köst, V. C., Nieweglowski, K., Meier, K. & Bock, K., 19 May 2024, 2024 47th International Spring Seminar on Electronics Technology (ISSE). IEEE, Vol. 2024. p. 1-4 4 p. 10603601Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Advancing Microelectronics
ISSNs: 2222-8748
IMAPS-International Microelectronics and Packaging Society, Taiwan, Province of China
Scopus rating (2023): CiteScore 0.1 SJR 0.106 SNIP 0
Journal
Soft Materials
ISSNs: 1539-445X
Additional searchable ISSN (electronic): 1539-4468
Taylor & Francis, London [u.a.], United Kingdom
Scopus rating (2023): CiteScore 2.9 SJR 0.32 SNIP 0.376
Journal
Measurement + control : the journal of the Institute of Measurement and Control
ISSNs: 0020-2940
Additional searchable ISSN (electronic): 2051-8730
Sage, London [u.a.], United Kingdom
Scopus rating (2019): CiteScore 1 SJR 0.208 SNIP 0.747
Indexed in DOAJ
Journal
Advanced packaging : an IHS Group publication
ISSNs: 1065-0555
Additional searchable ISSN (electronic): 1065-0555
IHS Publ. Group, United States of America
Journal
Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical Link
Mistry, A. S. (Speaker), Nieweglowski, K. K. (Involved person), Bock, K. (Involved person)9 Feb 2024
Activity: Talk or presentation at external institutions/events › Talk/Presentation › Contributed
Hybrid-Lithography for the Master of Multi-ModeWaveguides NIL Stamp
Mistry, A. S. (Speaker), Nieweglowski, K. K. (Involved person), Bock, K. (Involved person)6 Jul 2023
Activity: Talk or presentation at external institutions/events › Talk/Presentation › Contributed
Out-of-Plane Mirrors for Single-Mode Polymeric RDL using Direct Laser Writing
Mistry, A. S. (Speaker), Weyers, D. (Involved person), Nieweglowski, K. K. (Involved person), Bock, K. (Involved person)11 Nov 2022
Activity: Talk or presentation at external institutions/events › Talk/Presentation › Contributed