Institute of Electronic Packaging Technology
Organisational unit: Institute
Contact
- TUD website: https://www.avt.et.tu-dresden.de/
Related content and researchers (public profile)
- Researchers (public profile)
- Research output
- Journals
- Activities
Miniaturized Ultrasonic Transducer with PMN-PT Embedded into Flexible LCP Substrate for Biocompatible Applications
Kober, J., Trittler, T., Dorausch, E. M. G., Kühnöl, C., Weber, J., Hauer, M. & Oppermann, M. & 4 others, Heuer, H., Hampe, J., Nauber, R. & Herzog, M., 25 Nov 2025, (E-pub ahead of print) In: IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control. 7 p.Research output: Contribution to journal › Research article › Contributed › peer-review
Characterization and modeling of solder interconnects for wafer level packaging applications subjected to low cycle fatigue stress
Dudash, V., Machani, K. V., Meier, K., Geisler, H., Kuechenmeister, F., Wieland, M. & Bock, K., 23 Jul 2025, (E-pub ahead of print) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Research article › Contributed › peer-review
Smart Glove Integrated Sponge-Based Composite Sensors for Haptic Sensing Applications
Chakraborthy, A., Prokopchuk, A., Mamillapalli, G., Harija, H., Langer, E., Nuthalapati, S. & Nag, A. & 1 others, Altinsoy, M. E., 21 May 2025, (E-pub ahead of print) In: ACS applied electronic materials. 7, 11, p. 4822–4831 10 p.Research output: Contribution to journal › Research article › Contributed › peer-review
A first proposal of diagnostic strategy for microelectronics using resistance measurement under dynamic mechanical loads
Patrizi, G., Ciani, L., Catelani, M., Meier, K., Häusler, M., Höhne, R. & Bock, K., May 2025, In: Measurement: Sensors. 38, 101602.Research output: Contribution to journal › Research article › Contributed › peer-review
Development and Evaluation of Global-Local Finite Element Models for Solder Joint Reliability under Combined Vibration and Thermal Loads
Lyu, C., Meier, K. & Bock, K., 9 Apr 2025, Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025. Institute of Electrical and Electronics Engineers (IEEE), 7 p. 11006543Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control
ISSNs: 2694-0884
Additional searchable ISSN (electronic): 2694-0884
Institute of Electrical and Electronics Engineers (IEEE), United States of America
Journal
Advancing Microelectronics
ISSNs: 2222-8748
IMAPS-International Microelectronics and Packaging Society, Taiwan, Province of China
Scopus rating (2024): CiteScore 0.2 SJR 0.128 SNIP 0.095
Journal
Journal of Microelectronics and Electronic Packaging
ISSNs: 1551-4897
Additional searchable ISSN (electronic): 1551-4897
IMAPS-International Microelectronics and Packaging Society, United States of America
Scopus rating (2024): CiteScore 1.7 SJR 0.157 SNIP 0.486
Journal
Kunststoffe : Werkstoffe, Verarbeitung, Anwendung
ISSNs: 0023-5563
Carl Hanser Verlag GmbH & Co. KG
Journal
Co-packaged optics development with multi-lithography processing of polymeric optical interconnects
Nieweglowski, K. K. (Speaker)24 Sept 2024
Activity: Talk or presentation at external institutions/events › Keynote › Invited
Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical Link
Mistry, A. S. (Speaker), Nieweglowski, K. K. (Involved person), Bock, K. (Involved person)9 Feb 2024
Activity: Talk or presentation at external institutions/events › Talk/Presentation › Contributed
Hybrid-Lithography for the Master of Multi-ModeWaveguides NIL Stamp
Mistry, A. S. (Speaker), Nieweglowski, K. K. (Involved person), Bock, K. (Involved person)6 Jul 2023
Activity: Talk or presentation at external institutions/events › Talk/Presentation › Contributed
Out-of-Plane Mirrors for Single-Mode Polymeric RDL using Direct Laser Writing
Mistry, A. S. (Speaker), Weyers, D. (Involved person), Nieweglowski, K. K. (Involved person), Bock, K. (Involved person)11 Nov 2022
Activity: Talk or presentation at external institutions/events › Talk/Presentation › Contributed