Institute of Electronic Packaging Technology
Organisational unit: Institute
Contact
- TUD website: https://www.avt.et.tu-dresden.de/
Related content and researchers (public profile)
- Research output
- Journals
- Activities
Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration
Bickel, S., Quednau, S., Birlem, O., Graff, A., Altmann, F., Junghähnel, M. & Panchenko, J., Aug 2024, In: Journal of electronic materials. 53, 8, p. 4410-4420 11 p.Research output: Contribution to journal › Research article › Contributed › peer-review
Experimental investigations and material modeling of an elastomer jaw coupling
Ewert, A., Menning, J. D. M., Prokopchuk, A., Rosenlöcher, T., Vorrath, E-F. M., Wallmersperger, T. & Schlecht, B., 17 Jul 2024, In: Materials testing : Materialprüfung. 66, 9, 14 p.Research output: Contribution to journal › Research article › Contributed › peer-review
Microprinting process development enabling cost effective, high density and flexible electro-optical integration
Nieweglowski, K., Weyers, D., Mistry, A. & Bock, K., 31 May 2024, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC). IEEE, p. 1790-1796 7 p. 10565288Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Analysis of Electronic Modules for Construction Machines and Development of a Reliability Test Method
Häusler, M., Meier, K. & Bock, K., 19 May 2024, 2024 47th International Spring Seminar on Electronics Technology (ISSE). IEEE, Vol. 2024. p. 1-5 5 p. 10603578Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Development of Computationally Efficient Numerical Models for Assessing the Reliability of Electronic Components under Vibration Loads
Lyu, C., Meier, K. & Bock, K., 19 May 2024, 2024 47th International Spring Seminar on Electronics Technology (ISSE). IEEE, Vol. 2024. p. 1-6 6 p. 10603965Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Materials testing : Materialprüfung
ISSNs: 0025-5300
Additional searchable ISSN (electronic): 2195-8572
Carl Hanser Verlag, München, Germany
Scopus rating (2023): CiteScore 4.2 SJR 0.468 SNIP 0.805
Journal
Advancing Microelectronics
ISSNs: 2222-8748
IMAPS-International Microelectronics and Packaging Society, Taiwan, Province of China
Scopus rating (2023): CiteScore 0.1 SJR 0.106 SNIP 0
Journal
Journal of Microelectronics and Electronic Packaging
ISSNs: 1551-4897
Additional searchable ISSN (electronic): 1551-4897
IMAPS-International Microelectronics and Packaging Society, United States of America
Scopus rating (2023): CiteScore 1.3 SJR 0.16 SNIP 0.523
Journal
Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical Link
Mistry, A. S. (Speaker), Nieweglowski, K. K. (Involved person), Bock, K. (Involved person)9 Feb 2024
Activity: Talk or presentation at external institutions/events › Talk/Presentation › Contributed
Hybrid-Lithography for the Master of Multi-ModeWaveguides NIL Stamp
Mistry, A. S. (Speaker), Nieweglowski, K. K. (Involved person), Bock, K. (Involved person)6 Jul 2023
Activity: Talk or presentation at external institutions/events › Talk/Presentation › Contributed
Out-of-Plane Mirrors for Single-Mode Polymeric RDL using Direct Laser Writing
Mistry, A. S. (Speaker), Weyers, D. (Involved person), Nieweglowski, K. K. (Involved person), Bock, K. (Involved person)11 Nov 2022
Activity: Talk or presentation at external institutions/events › Talk/Presentation › Contributed