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Related content and researchers (public profile)

Study on Effect of Microstructure Evolution on Wafer Warpage for High-Temperature Annealed and Self-Annealed Copper Thin Films

Singh, P. K., Mueller, M., Geisler, H., Hecker, M., Yu, M., Breuer, D. & Machani, K. V. & 3 others, Meier, K., Kuechenmeister, F. & Bock, K., 10 Feb 2025, (E-pub ahead of print) In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

Bond Strength Comparison of Commercial and Custom Copper Sinter Pastes under Sinter Process Modifications

Meyer, J., Gierth, K. F. W., Meier, K. & Bock, K., Dec 2024, p. 657-662. 6 p.

Research output: Contribution to conferences › Paper › Contributed › peer-review

Integrating 3d printing into higher education curricula for electronics: challenges and opportunities

Patela, S., Nieweglowski, K., Sniadek, P., Laszczyk, K., Koest, V. C., Weyers, D. & Lettrichova, I. & 3 others, Pudiš, D., Bock, K. & Walczak, R., 13 Nov 2024, ICERI2024 Proceedings: 17th annual International Conference of Education, Research and Innovation. p. 8384-8392 9 p. (ICERI Proceedings).

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration

Bickel, S., Quednau, S., Birlem, O., Graff, A., Altmann, F., Junghähnel, M. & Panchenko, J., Aug 2024, In: Journal of electronic materials. 53, 8, p. 4410-4420 11 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

Microprinting process development enabling cost effective, high density and flexible electro-optical integration

Nieweglowski, K., Weyers, D., Mistry, A. & Bock, K., 31 May 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. IEEE, p. 1790-1796 7 p. 10565288

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

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