Professor (rtd.) of Electronics Packaging Technology
Organisational unit: Research/Working group
Organisation profile
Professor (rtd.): Prof. Dr.-Ing. Dr. h. c. Karlheinz Bock
Formerly holder of the Chair of Electronic Packaging Technology
Related content and researchers (public profile)
- Research output
- Journals
Ingestible active capsule for gastrointestinal microbiome sampling
Shahadha, M. H., Voigt, A., Gruner, D., Marschner, U., Le Floch, M., Hampe, J. & Brauer, F. & 4 others, Schostek, S., Luniak, M., Bock, K. & Richter, A., 7 Mar 2026, In: Biomedical microdevices. 28, 1, 24 p., 19.Research output: Contribution to journal › Research article › Contributed › peer-review
Electronics for the Tactile Internet
Wagner, J., Morath, H., Ott, L., Yin, R., Ernst, D., Nieweglowski, K. K. & Jobst, M. & 9 others, Podlubne, A., Gottschaldt, P., Wulf, C., Haase, J., Göhringer, D., Partzsch, J., Bock, K., Mayr, C. G. & Ellinger, F., Feb 2026, Humans, Robots and Virtual Worlds in the Tactile Internet. Fitzek, F. H. P., Li, S.-C., Speidel, S., Strufe, T., Mahmoodi, T. & Reisslein, M. (eds.). Academic Press, p. 301-311 11 p.Research output: Contribution to book/Conference proceedings/Anthology/Report › Chapter in book/Anthology/Report › Contributed › peer-review
Reflex-enhanced computing for adaptive 6G hardware
Liess, M., Demicoli, J., Tiedje, T., Lohrmann, M. A., Nickel, M., Luniak, M. & Prousalis, D. & 7 others, Wild, T., Tetzlaff, R., Göhringer, D., Mayr, C., Bock, K., Steinhorst, S. & Herkersdorf, A., 1 Jan 2026, 6G-life: Unveiling the Future of Technological Sovereignty, Sustainability, and Trustworthiness. Elsevier, p. 379-400 22 p.Research output: Contribution to book/Conference proceedings/Anthology/Report › Chapter in book/Anthology/Report › Contributed › peer-review
AI-Driven Surrogate Modeling and Uncertainty Quantification for Active Power Cycling in Power Electronics Packages
Barkur, D., Gromala, P. J., Meier, K. & Bock, K., 2026, Proceedings - 2026 IEEE 76th Electronic Components and Technology Conference, ECTC 2026. Institute of Electrical and Electronics Engineers (IEEE), p. 1036-1043 8 p. (Proceedings - Electronic Components and Technology Conference).Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Comparative Evaluation Methodology for Full Order and Superelement-Containing Finite Element Models for Predicting Solder Joint Fatigue
Lyu, C., Sriramulu, H., Meier, K., Bock, K. & Panchenko, J., 2026, Proceedings - 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026. Institute of Electrical and Electronics Engineers (IEEE), (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)).Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Biomedical microdevices
ISSNs: 1387-2176
Additional searchable ISSN (electronic): 1572-8781
Springer, Netherlands
Scopus rating (2025): CiteScore 6.6 SJR 0.66 SNIP 0.804
Journal