Dr.-Ing. Karsten Meier
Person

Affiliations

Chair of Electronic Packaging
- Academic Staff

Identification Numbers

ORCID	0000-0001-9720-0727
Scopus author ID	22835802100

Characterization and modeling of solder interconnects for wafer level packaging applications subjected to low cycle fatigue stress

Dudash, V., Machani, K. V., Meier, K., Geisler, H., Kuechenmeister, F., Wieland, M. & Bock, K., 23 Jul 2025, (E-pub ahead of print) In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 11, p. 2417-2428 12 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

A first proposal of diagnostic strategy for microelectronics using resistance measurement under dynamic mechanical loads

Patrizi, G., Ciani, L., Catelani, M., Meier, K., Häusler, M., Höhne, R. & Bock, K., May 2025, In: Measurement: Sensors. 38, 6 p., 101602.

Research output: Contribution to journal › Research article › Contributed › peer-review

Development and Evaluation of Global-Local Finite Element Models for Solder Joint Reliability under Combined Vibration and Thermal Loads

Lyu, C., Meier, K. & Bock, K., 9 Apr 2025, Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025. Institute of Electrical and Electronics Engineers (IEEE), 7 p. 11006543

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Temperature-Dependent Material Characterization of Back-End-of-Line Copper with Nanoindentation for FEM-Based Wafer Warpage Prediction

Singh, P. K., Geisler, H., Machani, K. V., Breuer, D., Meier, K., Kuechenmeister, F. & Bock, K., 9 Apr 2025, Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025. Institute of Electrical and Electronics Engineers (IEEE), 13 p. 11006541

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Study on Effect of Microstructure Evolution on Wafer Warpage for High-Temperature Annealed and Self-Annealed Copper Thin Films

Singh, P. K., Mueller, M., Geisler, H., Hecker, M., Yu, M., Breuer, D. & Machani, K. V. & 3 others, Meier, K., Kuechenmeister, F. & Bock, K., 10 Feb 2025, (E-pub ahead of print) In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 3, p. 576-590 15 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

View all research output (68)

Research Portal of the TU Dresden

Dr.-Ing. Karsten Meier
Person

Affiliations

Identification Numbers

Related content

Characterization and modeling of solder interconnects for wafer level packaging applications subjected to low cycle fatigue stress

A first proposal of diagnostic strategy for microelectronics using resistance measurement under dynamic mechanical loads

Development and Evaluation of Global-Local Finite Element Models for Solder Joint Reliability under Combined Vibration and Thermal Loads

Temperature-Dependent Material Characterization of Back-End-of-Line Copper with Nanoindentation for FEM-Based Wafer Warpage Prediction

Study on Effect of Microstructure Evolution on Wafer Warpage for High-Temperature Annealed and Self-Annealed Copper Thin Films