Chair of Electronics Packaging
Organisational unit: Chair
Organisation profile
Chair Holder: Prof. Dr.-Ing. Juliana Panchenko
Formerly holder of the Junior Professorship in Nanomaterials for Electronics Packaging
Related content and researchers (public profile)
- Researchers (public profile)
- Research output
Electronics for the Tactile Internet
Wagner, J., Morath, H., Ott, L., Yin, R., Ernst, D., Nieweglowski, K. K. & Jobst, M. & 9 others, Podlubne, A., Gottschaldt, P., Wulf, C., Haase, J., Göhringer, D., Partzsch, J., Bock, K., Mayr, C. G. & Ellinger, F., Feb 2026, Humans, Robots and Virtual Worlds in the Tactile Internet. Fitzek, F. H. P., Li, S.-C., Speidel, S., Strufe, T., Mahmoodi, T. & Reisslein, M. (eds.). Academic Press, p. 301-311 11 p.Research output: Contribution to book/Conference proceedings/Anthology/Report › Chapter in book/Anthology/Report › Contributed › peer-review
Reflex-enhanced computing for adaptive 6G hardware
Liess, M., Demicoli, J., Tiedje, T., Lohrmann, M. A., Nickel, M., Luniak, M. & Prousalis, D. & 7 others, Wild, T., Tetzlaff, R., Göhringer, D., Mayr, C., Bock, K., Steinhorst, S. & Herkersdorf, A., 1 Jan 2026, 6G-life: Unveiling the Future of Technological Sovereignty, Sustainability, and Trustworthiness. Elsevier, p. 379-400 22 p.Research output: Contribution to book/Conference proceedings/Anthology/Report › Chapter in book/Anthology/Report › Contributed › peer-review
Nanowire filled polymer films for 3D system integration
Graf, M., Meier, K., Haehnel, V., Schlörb, H., Eychmüller, A. & Wolter, K. J., 2011, 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011. 5940356. (IEEE International Conference on Interconnect Technology).Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review