Lifetime and reliability are crucial performance indicators for electronics especially in the fields of automotive, avionics and industrial electronics. Mechanical test procedures are key methods to assess lifetime and reliability which typically include several vibration test methods and drop or shock testing. Shock testing using shaker equipment is a relatively new topic which enables combined load scenarios. Previous works proposed a test vehicle which enabled efficient failure generation [1]. First test results showed a rapid decrease in solder joint reliability at raised temperatures. The test vehicle design was adapted for testing of QFN48 and leadless chip resistor (LCR0603) components in addition to the custom Flip-Chip (FC) components. Lifetime testing at board level using shock loads with 130 G amplitude and a pulse width of 2 ms was carried out at high temperature of 125 °C. Results clearly identified QFN solder joints as most critical compared to these of both other components. A test vehicle with mixed component types was developed to allow for direct comparison in terms of lifetime between the tested components. As expected, the QFN solder joints were revealed to be the most critical ones. LCRs placed in close proximity to QFN components were found to fail slightly earlier compared to those placed next to FC components. The assumed cause of this is a change in the local deformation behavior of the PCB in close proximity to the QFN and FC components respectively. Which in turn is due to the different stiffening effect of the QFN and FC components as they differ in footprint size, number and arrangement of solder joints as well as effective package stiffness. In-depth analysis by cross sectioning identified weak points in QFN solder joints, which could be mitigated by corner bond or side fill technologies. Both, test method and test vehicles design have proven themselves to examine the temperature dependent shock reliability of different package types.