Out-of-Plane Mirrors for Single-Mode Polymeric RDL using Direct Laser Writing
Activity: Talk or presentation at external institutions/events › Talk/Presentation › Contributed
Persons and affiliations
- Akash Sunilkumar Mistry - , Institute of Electronic Packaging Technology, Chair of Electronic Packaging Technology (Speaker)
- David Weyers - , Chair of Electronic Packaging Technology (Involved person)
- Krzysztof Kamil Nieweglowski - , Chair of Electronic Packaging Technology (Involved person)
- Karlheinz Bock - , Chair of Electronic Packaging Technology (Involved person)
Date
11 Nov 2022
Description
The growing demand for the Internet of Things (IoT) and Artificial Intelligence (AI) need high-speed commu-nication within short-range distances. In the Back-End-Of-Line (BEOL), Single-Mode Waveguide (SMW) with micro-mirror shows the promising application as an Optical Redistribution Layer (O-RDL) connecting photonic-chip at the interposer-level. The presented study shows the potential application of the 2-Photon-Polymerization (2PP) process for fabrication of out-of-plane coupling elements (micro-mirror) for SMW using low-loss Ormocer® hybrid polymers. This fabricated micro-mirror uses as a coupling element to connect the light from RDL to chips or for inter-layer connections at Interposer level. To evaluate the processing time, structural quality, and resolution of the printed micro-mirror, two types of lenses (63x and 25x) and Ormocer® polymers (OrmoComp and OrmoCore) were used. The optimization of the process flow for the micro-mirrors for SMW applications will be described in detail.Conference
Title | 9th IEEE Electronics System-Integration Technology Conference, ESTC 2022 |
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Duration | 13 - 16 September 2022 |
City | Sibiu |
Country | Romania |
Keywords
Subject groups, research areas, subject areas according to Destatis
Keywords
- Hybrid polymer, BEOL (Back-End-Of-Line), micro-mirror, 2PP-DLW (2-Photon-Polymerization Direct-Laser-Writing), SMW (Single-Mode-Waveguide), O-RDL (Optical-Redistribution Layer)