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Research Portal of the TU Dresden

IEEE Transactions on Components, Packaging and Manufacturing Technology

ISSNs: 2156-3950, 2156-3985

Institute of Electrical and Electronics Engineers Inc.

Scopus rating (2023): CiteScore 4.7 SJR 0.562 SNIP 1.119

Journal

Titles	IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE transactions on components, packaging, and manufacturing technology
ISSNs	2156-3950, 2156-3985
Publisher	Institute of Electrical and Electronics Engineers Inc.
ZDB-ID	2607366-3
ZDB-ID	2595289-4

Research output: Contribution to journal › Research article › Contributed › peer-review

Panchenko, I., Wenzel, L., Mueller, M., Rudolph, C., Hanisch, A. & Wolf, J. M., 1 Mar 2022, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12, 3, p. 410-421 12 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

Topal, E., Gluch, J., Clausner, A., Cardoso, A. & Zschech, E., 1 Mar 2021, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11, 3, p. 504-509 6 p., 9312164.

Research output: Contribution to journal › Research article › Contributed › peer-review

Mueller, M., Panchenko, J., Wiese, S. & Wolter, K.-J., 1 Jan 2020, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 1, p. 18-29 12 p., 8894079.

Research output: Contribution to journal › Research article › Contributed › peer-review

Research output: Contribution to journal › Editorial (Lead article) › Contributed › peer-review