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IEEE Transactions on Components, Packaging and Manufacturing Technology

ISSNs: 2156-3950, 2156-3985

Institute of Electrical and Electronics Engineers (IEEE)

Scopus rating (2025): CiteScore 5.9 SJR 0.763 SNIP 1.511

Journal

Titles	IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE transactions on components, packaging, and manufacturing technology
ISSNs	2156-3950, 2156-3985
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
ZDB-ID	2607366-3
ZDB-ID	2595289-4

Keywords

ASJC Scopus subject areas

Library keywords

620 Engineering and allied operations

Related content

Research output

Characterization and modeling of solder interconnects for wafer level packaging applications subjected to low cycle fatigue stress

Dudash, V., Machani, K. V., Meier, K., Geisler, H., Kuechenmeister, F., Wieland, M. & Bock, K., Nov 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 11, p. 2417-2428 12 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

Study on Effect of Microstructure Evolution on Wafer Warpage for High-Temperature Annealed and Self-Annealed Copper Thin Films

Singh, P. K., Mueller, M., Geisler, H., Hecker, M., Yu, M., Breuer, D. & Machani, K. V. & 3 others, Meier, K., Kuechenmeister, F. & Bock, K., 10 Feb 2025, (E-pub ahead of print) In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 3, p. 576-590 15 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

Diffusion of Silver in Liquid Tin Depending on the Temperature Gradient Along the Solder in Low-Voltage Power Fuses at Overcurrents

Büttner, L., Hildmann, C., Skrotzki, W. & Schlegel, S., 26 Jun 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 6, p. 849-858 10 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests

Panchenko, I., Wenzel, L., Mueller, M., Rudolph, C., Hanisch, A. & Wolf, J. M., 1 Mar 2022, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12, 3, p. 410-421 12 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

Determination of the Filler Distribution in an Epoxy Molding Compound Using High-Resolution X-Ray Computed Tomography

Topal, E., Gluch, J., Clausner, A., Cardoso, A. & Zschech, E., 1 Mar 2021, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11, 3, p. 504-509 6 p., 9312164.

Research output: Contribution to journal › Research article › Contributed › peer-review

View all research output (9)