In the era of the fourth industrial revolution, electronic assemblies are subjected to significant external stresses such as vibration and thermal loads, posing challenges to their reliability. While diagnostic and prognostic tools have been extensively studied in various domains, such as energy storage and mechanical equipment, the focus on microelectronic devices remains limited. This study addresses this gap by investigating the impact of mechanical loads, particularly vibration, on solder joints, which are critical components in electronic assemblies. This research presents preliminary findings from an experimental measurement campaign aimed at developing a diagnostic tool for assessing the health of microelectronics under vibration or shock loads. Measuring the resistance of multiple solder joints, it was possible to observe this evidence in high-resistance structures at chip level (i.e., around 1 Ω) without any filtering or post-processing analysis. By employing a continuous monitoring approach, the study demonstrates the potential to identify mechanical loads accurately, laying the groundwork for future diagnostic solutions in real-world applications.