IEEE Transactions on Device and Materials Reliability
ISSNs: 1530-4388
IEEE, New York [u. a.]
Scopus rating (2022): CiteScore 4.3 SJR 0.401 SNIP 1.077
Journal
| Titles |
|
|---|---|
| ISSNs | 1530-4388 |
| Publisher | IEEE, New York [u. a.] |
| ZDB-ID | 2057871-4 |
| ZDB-ID | 2061445-7 |
Related content
- Research output
Implication of Self-heating effect on device reliability characterization of Multi-finger n-MOSFETs on 22FDSOI
Chohan, T., Zhao, Z., Lehmann, S., Arfaoui, W., Bossu, G., Trommer, J., Slesazeck, S., & 2 othersMikolajick, T. & Siddabathula, M., 16 Jun 2022, In: IEEE transactions on device and materials reliability. 22, 3, p. 387-395 9 p.Research output: Contribution to journal › Research article › Contributed › peer-review
Comparative Study of Reliability of Ferroelectric and Anti-Ferroelectric Memories
Pesic, M., Schroeder, U., Slesazeck, S. & Mikolajick, T., Jun 2018, In: IEEE transactions on device and materials reliability. 18, 2, p. 154-162 9 p.Research output: Contribution to journal › Research article › Contributed › peer-review
Reliability comparison of ZrO<inf>2</inf>-based DRAM high-k dielectrics under DC and AC stress
Knebel, S., Zhou, D., Schroeder, U., Slesazeck, S., Pešíc, M., Agaiby, R., Heitmann, J., & 1 othersMikolajick, T., 2017, In: IEEE transactions on device and materials reliability. 17, 2, p. 324 - 330Research output: Contribution to journal › Research article › Contributed › peer-review
Non-Destructive Imaging of Organosilicate Glass (OSG) Thin Films at Low Voltage With the EsB Detector
Moayedi, E., Rosenkranz, R., Clausner, A., Pakbaz, K., Zschech, E. & Garitagoitia Cid, M. A., 1 Dec 2016, In: IEEE transactions on device and materials reliability. 16, 4, p. 461-464 4 p.Research output: Contribution to journal › Research article › Contributed › peer-review
TEM Investigation of Time-Dependent Dielectric Breakdown Mechanisms in Cu/Low-k Interconnects
Liao, Z., Gall, M., Yeap, K. B., Sander, C., Clausner, A., Muehle, U., Gluch, J., & 5 othersStandke, Y., Rosenkranz, R., Aubel, O., Hauschildt, M. & Zschech, E., 1 Dec 2016, In: IEEE transactions on device and materials reliability. 16, 4, p. 455-460 6 p.Research output: Contribution to journal › Research article › Contributed › peer-review