Impact of the Formation of Intermetallic Compounds in Current-Carrying Connections
Research output: Contribution to journal › Research article › Contributed
Contributors
Details
Original language | English |
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Pages (from-to) | 157-166 |
Journal | IEEE Transactions on Device and Materials Reliability |
Volume | 20 |
Issue number | 1 |
Publication status | Published - 2020 |
Peer-reviewed | No |
External IDs
Scopus | 85081747011 |
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ORCID | /0000-0002-4793-8800/work/166326177 |
Keywords
Keywords
- intermetallic compounds, current-carrying connections