Impact of the Formation of Intermetallic Compounds in Current-Carrying Connections

Research output: Contribution to journalResearch articleContributed

Contributors

Details

Original languageEnglish
Pages (from-to)157-166
JournalIEEE Transactions on Device and Materials Reliability
Volume20
Issue number1
Publication statusPublished - 2020
Peer-reviewedNo

External IDs

Scopus 85081747011
ORCID /0000-0002-4793-8800/work/166326177

Keywords

Keywords

  • intermetallic compounds, current-carrying connections