Impact of the Formation of Intermetallic Compounds in Current-Carrying Connections
Research output: Contribution to journal › Research article › Contributed
Contributors
Details
| Original language | English |
|---|---|
| Pages (from-to) | 157-166 |
| Journal | IEEE Transactions on Device and Materials Reliability |
| Volume | 20 |
| Issue number | 1 |
| Publication status | Published - 2020 |
| Peer-reviewed | No |
External IDs
| Scopus | 85081747011 |
|---|---|
| ORCID | /0000-0002-4793-8800/work/166326177 |
Keywords
Keywords
- intermetallic compounds, current-carrying connections