Junior Professorship in Nanomaterials for Electronics Packaging

Organisational unit: Junior professorship

Organisation profile

Former Chair Holder: Prof. Dr.-Ing. Iuliana Panchenko

Research continued as Chair of Electronic Packaging

Former unit

Active until. 31 Dec 2024.

Contact

TUD website: https://www.avt.et.tu-dresden.de/en/iavt-zmp

Parent units

Institute of Electronic Packaging Technology

Related content and researchers (public profile)

Research output
Journals

Reliability Analysis of Surface Mount Interconnect Technologies Suitable for Temperatures Up to 200°C

Albrecht, O., Müller, M., Petersen, L., Nowotnik, L. F. T. & Panchenko, J., 13 Sept 2024, 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). IEEE Canada, 8 p. 10712075. (Electronics System-Integration Technology Conference, ESTC).

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed

Radiografische Untersuchung von Silber-Sinterverbindungen mit dem Multi-Energie-Ansatz

Albrecht, O., Oppermann, M., Zerna, T. & Zhao, M., 5 Mar 2024.

Research output: Contribution to conferences › Paper › Contributed › peer-review

Contact Thermography – New findings, new ideas

Oppermann, M., Albrecht, O., Zerna, T. & Borngräber, L. S., 2024, 10 TH IEEE ELECTRONICS SYSTEM- INTEGRATION TECHNOLOGY CONFERENCE: Proceedings. Institute of Electrical and Electronics Engineers (IEEE), 6 p.

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Cu nanowire fine-pitch joints for next gen heterogeneous chiplet integration

Bickel, S., Quednau, S., Birlem, O., Panchenko, J. & Junghahnel, M., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers (IEEE), p. 1376-1381 6 p. (Proceedings - Electronic Components and Technology Conference).

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Influence of Heat Treatment on the Quality of Die-to-Wafer Hybrid Bond Interconnects

Wenzel, L., Rudolph, C., Shehzad, A., Mukhopadhyay, P., Fulford, H. J., Junghaehnel, M. & Panchenko, J., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers (IEEE), p. 1830-1836 7 p. (Proceedings - Electronic Components and Technology Conference).

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

View all research output (54)