In power electronic assemblies, e.g. electro mobility solutions or converters, more and more power semiconductors are being used as bare die in order to implement thermal management. The connection technologies used here are soldering and sintering with silver pastes - in the future with copper pastes. The usual non-destructive testing methods have so far failed when inspecting thin sintered connections. We have already presented contact thermography as a possible solution to this problem at ESTC 2020 in Norway, as the target function “heat dissipation” is also the information carrier about the nature of the connection stack. As part of the AnkoTherm joint project funded by the German government, in which we worked with the project partners Kraus Hardware GmbH and budatec GmbH, the idea was further developed and an industry-oriented testing solution was presented at the “productronica” trade fair in 2023 in Munich.