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Research Portal of the TU Dresden

Centre for Microtechnical Manufacturing

Organisational unit: Centre

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TUD website: https://www.avt.et.tu-dresden.de/

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Central units at the Faculty of Electrical and Computer Engineering

Radiografische Untersuchung von Silber-Sinterverbindungen mit dem Multi-Energie-Ansatz

Albrecht, O., Oppermann, M., Zerna, T. & Zhao, M., 5 Mar 2024.

Research output: Contribution to conferences › Paper › Contributed › peer-review

Contact Thermography – New findings, new ideas

Oppermann, M., Albrecht, O., Zerna, T. & Borngräber, L. S., 2024, 10 TH IEEE ELECTRONICS SYSTEM- INTEGRATION TECHNOLOGY CONFERENCE: Proceedings. IEEE, 6 p.

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modeling

Dudash, V., Machani, K. V., Meier, K., Geisler, H., Mueller, M., Kuechenmeister, F., Wieland, M., & 1 othersBock, K., 8 Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). IEEE, p. 757-763 7 p. 10457727

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Feasibility Investigation of Machine Learning for Electronic Reliability Analysis using FEA

Höhne, R., Albrecht, O., Yichen, Q., Meier, K. & Bock, K., 2023, Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc., p. 1181-1186 6 p. (Proceedings - Electronic Components and Technology Conference, Vol. 2023-May).

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line

Singh, P. K., Muller, M., MacHani, K. V., Breuer, D., Hecker, M., Meier, K., Kuechenmeister, F., & 2 othersWieland, M. & Bock, K., 2023, 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Conference on Interconnect Technology).

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

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