Centre for Microtechnical Manufacturing
Organisational unit: Centre
Contact
- TUD website: https://www.avt.et.tu-dresden.de/
Related content and researchers (public profile)
- Research output
- Journals
Radiografische Untersuchung von Silber-Sinterverbindungen mit dem Multi-Energie-Ansatz
Albrecht, O., Oppermann, M., Zerna, T. & Zhao, M., 5 Mar 2024.Research output: Contribution to conferences › Paper › Contributed › peer-review
Contact Thermography – New findings, new ideas
Oppermann, M., Albrecht, O., Zerna, T. & Borngräber, L. S., 2024, 10 TH IEEE ELECTRONICS SYSTEM- INTEGRATION TECHNOLOGY CONFERENCE: Proceedings. IEEE, 6 p.Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modeling
Dudash, V., Machani, K. V., Meier, K., Geisler, H., Mueller, M., Kuechenmeister, F. & Wieland, M. & 1 others, Bock, K., 8 Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). IEEE, p. 757-763 7 p. 10457727Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Feasibility Investigation of Machine Learning for Electronic Reliability Analysis using FEA
Höhne, R., Albrecht, O., Yichen, Q., Meier, K. & Bock, K., 2023, Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc., p. 1181-1186 6 p. (Proceedings - Electronic Components and Technology Conference, Vol. 2023-May).Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line
Singh, P. K., Muller, M., MacHani, K. V., Breuer, D., Hecker, M., Meier, K. & Kuechenmeister, F. & 2 others, Wieland, M. & Bock, K., 2023, 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Conference on Interconnect Technology).Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
JOURNAL OF MATERIALS RESEARCH
ISSNs: 0884-2914, 2044-5326
Additional searchable ISSN (electronic): 1092-8928
Springer International Publishing AG
Scopus rating (2023): CiteScore 4.5 SJR 0.569 SNIP 0.689
Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSNs: 2156-3950, 2156-3985
Institute of Electrical and Electronics Engineers Inc.
Scopus rating (2023): CiteScore 4.7 SJR 0.562 SNIP 1.119
Journal
Cement and Concrete Composites
ISSNs: 0958-9465, 0262-5075, 0142-0968
Elsevier, Oxford [u.a.]
Scopus rating (2023): CiteScore 18.7 SJR 3.65 SNIP 2.565
Journal
Japanese Journal of Applied Physics, Part 2: Letters
ISSNs: 0021-4922, 1347-4065
Japan Society of Applied Physics
Scopus rating (2023): CiteScore 3 SJR 0.307 SNIP 0.631
Journal