Central units at the Faculty of Electrical and Computer Engineering
Organisational unit: Central unit
Related content and researchers (public profile)
- Research output
Radiografische Untersuchung von Silber-Sinterverbindungen mit dem Multi-Energie-Ansatz
Albrecht, O., Oppermann, M., Zerna, T. & Zhao, M., 5 Mar 2024.Research output: Contribution to conferences › Paper › Contributed › peer-review
High Gain Graphene Based Hot Electron Transistor with Record High Saturated Output Current Density
Strobel, C., Chavarin, C. A., Knaut, M., Völkel, S., Albert, M., Hiess, A., Max, B., & 3 othersWenger, C., Kirchner, R. & Mikolajick, T., Feb 2024, In: Advanced electronic materials. 10, 2, 7 p., 2300624.Research output: Contribution to journal › Research article › Contributed › peer-review
Feasibility Investigation of Machine Learning for Electronic Reliability Analysis using FEA
Höhne, R., Albrecht, O., Yichen, Q., Meier, K. & Bock, K., 2023, Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc., p. 1181-1186 6 p. (Proceedings - Electronic Components and Technology Conference, Vol. 2023-May).Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line
Singh, P. K., Muller, M., MacHani, K. V., Breuer, D., Hecker, M., Meier, K., Kuechenmeister, F., & 2 othersWieland, M. & Bock, K., 2023, 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Conference on Interconnect Technology).Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Reducing the tunneling barrier thickness of bilayer ferroelectric tunnel junctions with metallic electrodes
Lancaster, S., Segatto, M., Silva, C., Max, B., Mikolajick, T., Esseni, D., Driussi, F., & 1 othersSlesazeck, S., 2023, 2023 Device Research Conference, DRC 2023. Institute of Electrical and Electronics Engineers Inc., (Device Research Conference - Conference Digest, DRC, Vol. 2023-June).Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review