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Low temperature Cu/In bonding for 3D integration

Research output: Contribution to conferences › Paper › Contributed › peer-review

Contributors

Juliana Panchenko - (Author)
Steffen Bickel - , Institute of Electronic Packaging Technology, Junior Professorship in Nanomaterials for Electronics Packaging (Author)
Jörg Meyer - , Chair of Electronic Packaging Technology (Author)
Maik Müller - , Centre for Microtechnical Manufacturing, Chair of Electronic Packaging Technology (Author)
M Jürgen Wolf - , Fraunhofer Institute for Reliability and Microintegration, University of Cologne (Author)

Details

Original language	English
Publication status	Published - 2017
Peer-reviewed	Yes

Conference

Title	IEEE International Workshop on Low Temperature Bonding for 3D Integration
Abbreviated title	LTB-3D
Conference number	5
Duration	16 - 18 May 2017
Website	https://ieeexplore.ieee.org/xpl/conhome/7939938/proceeding
Location	Tokyo
City

External IDs

Scopus	85022205968
ORCID	/0000-0001-8576-7611/work/165877186