The accuracy of thermomechanical finite element modeling (FEM) strongly depends on the mechanical material data implemented in the simulation setup. The focus of this study was to derive creep models for SAC405 and SACQ solder alloys that can be used for predictive FEM of microelectronic packages that are stressed at temperature cycling test conditions.This work presents the results of a temperature-dependent creep characterization using the constant force nanoindentation method for SAC405 and SACQ solder alloys and the validation of the obtained data by means of a comparative FEM study. The collected material data were implemented in a3DFE model of a wafer level chip scale package. A validation of the Garofalo modeling results was conducted for both solder alloys by comparing against viscoplasticity and creep material models from literature.