Study on the Effect of the Warpage of Electronic Assemblies on Their Reliability
Research output: Contribution to conferences › Paper › Contributed › peer-review
Contributors
Details
| Original language | English |
|---|---|
| Publication status | Published - 15 Sept 2020 |
| Peer-reviewed | Yes |
Conference
| Title | 8th IEEE Electronics System-Integration Technology Conference |
|---|---|
| Abbreviated title | ESTC 2020 |
| Conference number | 8 |
| Duration | 15 - 18 September 2020 |
| Location | Online |
| City | Tonsberg |
| Country | Norway |
External IDs
| Scopus | 85096625166 |
|---|---|
| ORCID | /0000-0001-9720-0727/work/192581599 |