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In-situ X-ray Characterization of IC Package Warpage at Elevated Temperatures

Research output: Contribution to conferences › Paper › Contributed › peer-review

Contributors

Oliver Albrecht - , Junior Professorship in Nanomaterials for Electronics Packaging, Chair of Electronic Packaging Technology (Author)
Heinz Wohlrabe - (Author)
Karsten Meier - , Chair of Electronic Packaging Technology (Author)
Martin Oppermann - , Centre for Microtechnical Manufacturing (Author)
Thomas Zerna - , Centre for Microtechnical Manufacturing (Author)

Details

Original language	English
Publication status	Published - Sept 2018
Peer-reviewed	Yes

Conference

Title	7th Electronic System-Integration Technology Conference
Abbreviated title	ESTC 2018
Conference number	7
Duration	18 - 21 September 2018
Website	https://www.estc-conference.net/previous-conferences/
Location	Westin Bellevue
City	Dresden
Country	Germany

External IDs

Scopus	85060030085
ORCID	/0000-0001-9720-0727/work/192581601