Determination of the Sn/IMC ratio in solder joints combining electrochemistry and confocal microscopy
Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed
Contributors
Abstract
In this work we present a novel method to determine the Sn/IMC (intermetallic compound) ratio in various SAC (Sn-Ag-Cu) alloy based solder joints utilizing selective electrochemical etching and confocal microscopy. We discuss the principles and possibilities of this combined method and present pilot measurement results regarding the determination of the Sn/IMC ratio for solder joints prepared with different soldering techniques.
Details
| Original language | English |
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| Title of host publication | 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) |
| Publisher | IEEE |
| Pages | 81-84 |
| Number of pages | 4 |
| ISBN (print) | 978-1-4673-4759-4 |
| Publication status | Published - 28 Oct 2012 |
| Peer-reviewed | No |
Conference
| Title | 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) |
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| Duration | 25 - 28 October 2012 |
| Location | Alba Iulia, Romania |
External IDs
| Scopus | 84872397771 |
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Keywords
Keywords
- Tin, Soldering, Etching, Microstructure, Intermetallic