Determination of the Sn/IMC ratio in solder joints combining electrochemistry and confocal microscopy

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragen

Beitragende

Abstract

In this work we present a novel method to determine the Sn/IMC (intermetallic compound) ratio in various SAC (Sn-Ag-Cu) alloy based solder joints utilizing selective electrochemical etching and confocal microscopy. We discuss the principles and possibilities of this combined method and present pilot measurement results regarding the determination of the Sn/IMC ratio for solder joints prepared with different soldering techniques.

Details

OriginalspracheEnglisch
Titel2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Herausgeber (Verlag)IEEE
Seiten81-84
Seitenumfang4
ISBN (Print)978-1-4673-4759-4
PublikationsstatusVeröffentlicht - 28 Okt. 2012
Peer-Review-StatusNein

Konferenz

Titel2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Dauer25 - 28 Oktober 2012
OrtAlba Iulia, Romania

Externe IDs

Scopus 84872397771

Schlagworte

Schlagwörter

  • Tin, Soldering, Etching, Microstructure, Intermetallic