Cu-In-Microbumps for Low-Temperature Bonding of Fine-Pitch-Interconnects

Research output: Contribution to conferences › Paper › Contributed › peer-review

Contributors

Steffen Bickel - , Institute of Electronic Packaging Technology, Junior Professorship in Nanomaterials for Electronics Packaging (Author)
Juliana Panchenko - (Author)
Wieland Wahrmund - (Author)
Volker Neumann - , Chair of Nanoelectronics (Author)
Jörg Meyer - , Chair of Electronic Packaging Technology (Author)
M Jürgen Wolf - , Fraunhofer Institute for Reliability and Microintegration, University of Cologne (Author)

Title	2017 IEEE 67th Electronic Components and Technology Conference
Abbreviated title	ECTC 2017
Conference number	67
Duration	30 May - 2 June 2017
City	Lake Buena Vista
Country	United States of America

Scopus	85028040468
ORCID	/0000-0001-8576-7611/work/165877185