The effect of downscaling the dimensions of solder interconnects on their creep properties
Research output: Contribution to journal › Conference article › Contributed › peer-review
Contributors
Abstract
Thermal, Mechanical and Multi-physics Simulation and Experiments in Micro-electronics and Micro-systems (EuroSimE 2007)
Details
| Original language | English |
|---|---|
| Pages (from-to) | 843-850 |
| Number of pages | 8 |
| Journal | Microelectronics Reliability |
| Volume | 48 |
| Issue number | 6 |
| Publication status | Published - 2008 |
| Peer-reviewed | Yes |
External IDs
| Scopus | 45949093528 |
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