TEM Investigation of Time-Dependent Dielectric Breakdown Mechanisms in Cu/Low-k Interconnects

Research output: Contribution to journal › Research article › Contributed › peer-review

Contributors

  • Z. Liao - , Fraunhofer Institute for Ceramic Technologies and Systems (Author)
  • M. Gall - (Author)
  • K. B. Yeap - (Author)
  • C. Sander - (Author)
  • A. Clausner - (Author)
  • U. Muehle - , Fraunhofer Institute for Ceramic Technologies and Systems (Author)
  • J. Gluch - , Chair of Materials Science and Nanotechnology (Author)
  • Y. Standke - (Author)
  • R. Rosenkranz - , Fraunhofer Institute for Ceramic Technologies and Systems (Author)
  • O. Aubel - (Author)
  • M. Hauschildt - (Author)
  • E. Zschech - , Fraunhofer Institute for Ceramic Technologies and Systems (Author)

Details

Original languageEnglish
Pages (from-to)455-460
Number of pages6
JournalIEEE transactions on device and materials reliability
Volume16
Issue number4
Publication statusPublished - 1 Dec 2016
Peer-reviewedYes

External IDs

Scopus 85004010356

Keywords

Research priority areas of TU Dresden

Library keywords