Skip to content Skip to footer

Research Portal of the TU Dresden

Soft robotic structures by smart encapsulation of electronic devices

Research output: Contribution to journal › Conference article › Contributed › peer-review

Contributors

Anja Winkler - , Institute of Lightweight Engineering and Polymer Technology (Author)
Adrian Ehrenhofer - , Chair of Mechanics of Multifunctional Structures (Author)
Thomas Wallmersperger - , Chair of Mechanics of Multifunctional Structures (Author)
Maik Gude - , Chair of Lightweight Design and Structural Assessment (Author)
Niels Modler - , Chair of Function-integrative Leightweight Engineering (Author)

Details

Original language	English
Pages (from-to)	277-282
Number of pages	6
Journal	Procedia manufacturing
Volume	52
Publication status	Published - 2020
Peer-reviewed	Yes

Conference

Title	5th International Conference on System-Integrated Intelligence
Subtitle	System-Integrated Intelligence – Intelligent, Flexible and Connected Systems in Products and Production
Abbreviated title	SysInt 2020
Conference number
Duration	11 - 13 November 2020
Location
City	Bremen
Country	Germany

External IDs

Scopus	85100775182
researchoutputwizard	legacy.publication#87947
ORCID	/0000-0002-2370-8381/work/141545320
ORCID	/0000-0003-2834-8933/work/142238269
ORCID	/0000-0002-8854-7726/work/142242069
ORCID	/0000-0003-1370-064X/work/142243462

Keywords

Keywords

soft robotics, positioning mechanism, encapsulated electronic, battery