3D integration and additive technologies are an emerging field in electronic packaging, which becomes more and more established. A new technology approach is presented, aiming to build the package around the components. The components are embedded in an additive process, where a redistribution layer (RDL) is created on top of this embedding surface. The shape of package and RDL is individually adjustable. This creates many possibilities for new applications. However, reliability experiences on additive 3D electronic packages are still lacking. The novel technology has the advantage to use copper for the RDL instead of sinter materials, which are used in common additive manufacture processes such as aerosol-, inkjet-or screen-printing. Functional reliability is demonstrated on an embedded 0201 LED with such copper RDL. Applying a temperature shock test of-20/85 °C for 2000 cycles has been accomplished without any trace of degradation. Functional tests, optical and imaging (X-Ray, SEM) analysis have been performed additionally to demonstrate the potential reliability of this novel integration technology. Furthermore, adhesion of the RDL to the substrate has been investigated by tape and pull tests. Both tests could not provoke delamination nor erosion of copper nor any other defects. This indicates the technology potential to perform well even considering harsh environmental requirements and should be further investigated.