Multichannel optical link based on polymer multimode waveguides for board-level interchip communication
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Contributors
Abstract
This paper discusses technology development for integration of parallel optical interconnect on board-level. The interchip link is based on planar polymeric optical multimode waveguides and wafer-level out-of-plane coupling optics. Realized on-board waveguides feature low insertion loss with minimum attenuation coefficient of 0.024 dB/cm. Integration of polymeric waveguides on flexible substrate is shown since the realization of an overlay optical substrate enhances the yield and testability of the final hybrid electro-optical printed circuit board (EOPCB). The development of wafer-level coupling optics is described. This optics is based on a glass interposer with integrated waveguides (planar lightwave circuit PLC) and integrated micro-mirrors for light redirection. Passive alignment processes are incorporated for the assembly of optical and optoelectronic components, which enable precise and cost-effective fabrication.
Details
Original language | German |
---|---|
Title of host publication | 2015 European Microelectronics Packaging Conference (EMPC) |
Publisher | IEEE |
Pages | 1-7 |
Number of pages | 7 |
ISBN (print) | 978-0-9568-0862-2 |
Publication status | Published - 16 Sept 2015 |
Peer-reviewed | Yes |
Conference
Title | 2015 European Microelectronics Packaging Conference (EMPC) |
---|---|
Duration | 14 - 16 September 2015 |
Location | Friedrichshafen, Germany |
External IDs
ORCID | /0000-0002-0757-3325/work/139064861 |
---|
Keywords
Keywords
- Optical waveguides, Optical interconnections, Optical coupling, Planar waveguides, Optical attenuators, Couplings, Optical polymers