Multichannel optical link based on polymer multimode waveguides for board-level interchip communication
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Beitragende
Abstract
This paper discusses technology development for integration of parallel optical interconnect on board-level. The interchip link is based on planar polymeric optical multimode waveguides and wafer-level out-of-plane coupling optics. Realized on-board waveguides feature low insertion loss with minimum attenuation coefficient of 0.024 dB/cm. Integration of polymeric waveguides on flexible substrate is shown since the realization of an overlay optical substrate enhances the yield and testability of the final hybrid electro-optical printed circuit board (EOPCB). The development of wafer-level coupling optics is described. This optics is based on a glass interposer with integrated waveguides (planar lightwave circuit PLC) and integrated micro-mirrors for light redirection. Passive alignment processes are incorporated for the assembly of optical and optoelectronic components, which enable precise and cost-effective fabrication.
Details
Originalsprache | Deutsch |
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Titel | 2015 European Microelectronics Packaging Conference (EMPC) |
Herausgeber (Verlag) | IEEE |
Seiten | 1-7 |
Seitenumfang | 7 |
ISBN (Print) | 978-0-9568-0862-2 |
Publikationsstatus | Veröffentlicht - 16 Sept. 2015 |
Peer-Review-Status | Ja |
Konferenz
Titel | 2015 European Microelectronics Packaging Conference (EMPC) |
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Dauer | 14 - 16 September 2015 |
Ort | Friedrichshafen, Germany |
Externe IDs
ORCID | /0000-0002-0757-3325/work/139064861 |
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Schlagworte
Schlagwörter
- Optical waveguides, Optical interconnections, Optical coupling, Planar waveguides, Optical attenuators, Couplings, Optical polymers