Low-temperature transient liquid phase bonding via electroplated Sn/In-Sn metallization
Research output: Contribution to journal › Research article › Contributed › peer-review
Contributors
Abstract
Sn/In-Sn bonding interfaces obtained by the transient liquid phase (TLP) reaction were investigated for applications in low-temperature assembly. Bonding was achieved at temperatures below 150 °C with a low bonding pressure. Although a few voids were formed at the interfaces after bonding, the In-Sn metallization enabled low-temperature bonding due to the low eutectic temperature. A bonding mechanism to achieve this novel In-Sn low-temperature assembly was also proposed.
Details
| Original language | English |
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| Pages (from-to) | 2510-2515 |
| Number of pages | 6 |
| Journal | Journal of Materials Research and Technology |
| Volume | 19 |
| Publication status | Published - Jul 2022 |
| Peer-reviewed | Yes |
External IDs
| ORCID | /0000-0002-0757-3325/work/139064901 |
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Keywords
ASJC Scopus subject areas
Keywords
- Assembly technology, Electronic materials, In-Sn Intermetallics, Interfaces, Transient liquid phase reaction