In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures

Research output: Contribution to journal › Research article › Contributed › peer-review

Contributors

  • Zhongquan Liao - , Dresden Center for Nanoanalysis (DCN) (Author)
  • Martin Gall - (Author)
  • Kong Boon Yeap - (Author)
  • Christoph Sander - (Author)
  • Uwe Muehle - (Author)
  • Juergen Gluch - (Author)
  • Yvonne Standke - (Author)
  • Oliver Aubel - (Author)
  • Norman Vogel - (Author)
  • Meike Hauschildt - (Author)
  • Armand Beyer - (Author)
  • Hans-Juergen Engelmann - (Author)
  • Ehrenfried Zschech - (Author)

Details

Original languageEnglish
Pages (from-to)47-53
Number of pages7
JournalMicroelectronic Engineering
Volume137
Publication statusPublished - 2 Apr 2015
Peer-reviewedYes

External IDs

Scopus 85027938378

Keywords

Library keywords