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Research Portal of the TU Dresden

Microelectronic Engineering

ISSNs: 0167-9317

Elsevier Science B.V., Netherlands

Scopus rating (2022): CiteScore 5.5 SJR 0.467 SNIP 0.859

Journal

Titles	Microelectronic Engineering
Additional searchable titles	Microelectronic engineering, Microelectronic engineering : an international journal of semiconductor manufacturing technology
ISSNs	0167-9317
Publisher	Elsevier Science B.V.
Country/Territory	Netherlands
ZDB-ID	605230-7
ZDB-ID	1497065-X

Keywords

ASJC Scopus subject areas

Library keywords

620 Engineering and allied operations

Related content

Research output

Solid-state dewetting of single-crystal silicon on insulator: effect of annealing temperature and patch size

Abbarchi, M., Naffouti, M., Lodari, M., Salvalaglio, M., Backofen, R., Bottein, T., Voigt, A., & 10 othersDavid, T., Claude, J-B., Bouabdellaoui, M., Benkouider, A., Fraj, I., Favre, L., Ronda, A., Berbezier, I., Grosso, D. & Bollani, M., 15 Apr 2018, In: Microelectronic Engineering. 190, p. 1-6 6 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

Characterization of self-assembled monolayers for CueCu bonding technology

Lykova, M., Langer, E., Hinrichs, K., Panschenko, I., Meyer, J., Künzelmann, U., Wolf, M. J., & 1 othersLang, K. D., 2018, In: Microelectronic Engineering. 202, p. 19-24 6 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

Optimizing process conditions for improved Hf<inf>1 − x</inf>Zr<inf>x</inf>O<inf>2</inf>ferroelectric capacitor performance

Mittmann, T., Fengler, F. P. G., Richter, C., Park, M. H., Mikolajick, T. & Schroeder, U., 2017, In: Microelectronic Engineering. 178, p. 48-51 4 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

On/off-ratio dependence of bulk hetero junction photodiodes and its impact on electro-optical properties

Jahnel, M., Thomschke, M., Ullbrich, S., Fehse, K., An, J. D., Park, H., Leo, K., & 2 othersIm, C. & Kirchhoff, V., 20 Feb 2016, In: Microelectronic Engineering. 152, p. 20-25

Research output: Contribution to journal › Research article › Contributed › peer-review

In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures

Liao, Z., Gall, M., Yeap, K. B., Sander, C., Muehle, U., Gluch, J., Standke, Y., & 6 othersAubel, O., Vogel, N., Hauschildt, M., Beyer, A., Engelmann, H-J. & Zschech, E., 2 Apr 2015, In: Microelectronic Engineering. 137, p. 47-53 7 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

View all research output (21)