Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned Wafer

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionContributedpeer-review

Contributors

Abstract

With the increased technological advancement within the semiconductor industry, there has been a need for wafer level products that allow for higher electrical performance and increased power efficiency. This leads to more metal content in the back-end-of-line wafer fabrication process. During the wafer fabrication process a large amount of stress is generated in back-end-of-line which can lead to severe wafer bow. High wafer bow can cause fabrication issues. In order to understand and predict the wafer bow, finite element method based models were developed to support back-end-of-line process step definitions and setting design rules to limit the wafer bow. In the finite element method based model, the fully patterned back-end-of-line stack is replaced by effective orthotropic material properties generated at several die level models to capture the non-uniform metal density across the wafer. Finally, the current study shows that the newly developed finite element method models are in good agreement with experimental data.

Details

Original languageEnglish
Title of host publication2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
PublisherIEEE
Pages1-10
Number of pages10
ISBN (electronic)9798350345971
ISBN (print)979-8-3503-4598-8
Publication statusPublished - 19 Apr 2023
Peer-reviewedYes

Conference

Title24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Abbreviated titleEuroSimE 2023
Conference number24
Duration16 - 19 April 2023
LocationHotel Weitzer
CityGraz
CountryAustria

External IDs

Scopus 85158095231
Mendeley 43eaddcd-d7f1-3014-85b4-465e0cc6758c
ORCID /0000-0002-0757-3325/work/139064822

Keywords

Keywords

  • Semiconductor device modeling, Fabrication, Micromechanical devices, Electronics industry, Metals, Predictive models, Finite element analysis, Wafer bow, back-end-of-line, finite element modelling, wafer warpage