Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned Wafer
Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Contributors
Abstract
With the increased technological advancement within the semiconductor industry, there has been a need for wafer level products that allow for higher electrical performance and increased power efficiency. This leads to more metal content in the back-end-of-line wafer fabrication process. During the wafer fabrication process a large amount of stress is generated in back-end-of-line which can lead to severe wafer bow. High wafer bow can cause fabrication issues. In order to understand and predict the wafer bow, finite element method based models were developed to support back-end-of-line process step definitions and setting design rules to limit the wafer bow. In the finite element method based model, the fully patterned back-end-of-line stack is replaced by effective orthotropic material properties generated at several die level models to capture the non-uniform metal density across the wafer. Finally, the current study shows that the newly developed finite element method models are in good agreement with experimental data.
Details
Original language | English |
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Title of host publication | 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
Publisher | IEEE |
Pages | 1-10 |
Number of pages | 10 |
ISBN (electronic) | 9798350345971 |
ISBN (print) | 979-8-3503-4598-8 |
Publication status | Published - 19 Apr 2023 |
Peer-reviewed | Yes |
Conference
Title | 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems |
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Abbreviated title | EuroSimE 2023 |
Conference number | 24 |
Duration | 16 - 19 April 2023 |
Location | Hotel Weitzer |
City | Graz |
Country | Austria |
External IDs
Scopus | 85158095231 |
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Mendeley | 43eaddcd-d7f1-3014-85b4-465e0cc6758c |
ORCID | /0000-0002-0757-3325/work/139064822 |
Keywords
ASJC Scopus subject areas
Keywords
- Semiconductor device modeling, Fabrication, Micromechanical devices, Electronics industry, Metals, Predictive models, Finite element analysis, Wafer bow, back-end-of-line, finite element modelling, wafer warpage