Cu-In fine-pitch-interconnects: influence of processing conditions on the interconnection quality

Research output: Contribution to conferences › Paper › Contributed › peer-review

Contributors

Steffen Bickel - , Institute of Electronic Packaging Technology, Junior Professorship in Nanomaterials for Electronics Packaging (Author)
Shawon Sen - (Author)
Jörg Meyer - , Chair of Electronic Packaging Technology (Author)
Juliana Panchenko - (Author)
M Jürgen Wolf - , Fraunhofer Institute for Reliability and Microintegration, University of Cologne (Author)

Title	7th Electronic System-Integration Technology Conference
Abbreviated title	ESTC 2018
Conference number	7
Duration	18 - 21 September 2018
Website	https://www.estc-conference.net/previous-conferences/
Location	Westin Bellevue
City	Dresden
Country	Germany

Scopus	85060059318
ORCID	/0000-0001-8576-7611/work/165877183