Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionContributedpeer-review

Contributors

Abstract

Temperature-dependent creep characterization of SAC405 and SACQ solder alloys was performed using the constant force nanoindentation method. Creep rate behavior was investigated in a temperature range from −55°C to 175°C to develop the Garofalo creep model for both materials. The bipartite Garofalo model was proposed to describe a creep behavior for the whole temperature range, as the single model was not suitable to describe experimentally measured creep rates accurately.The derived Garofalo creep models were implemented in the thermomechanical finite element (FE) model to simulate accumulated creep, during two different temperature cycling conditions. The FE results of the derived bipartite Garofalo model were compared with the classic single model approach. In addition, using FE analysis, Garofalo material models were compared to Anand models available from literature for corresponding alloys.

Details

Original languageEnglish
Title of host publication2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages1-6
Number of pages6
ISBN (electronic)9798350393637
ISBN (print)979-8-3503-9364-4
Publication statusPublished - 10 Apr 2024
Peer-reviewedYes

Conference

Title25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Abbreviated titleEuroSimE 2024
Conference number25
Duration7 - 10 April 2024
LocationHotel Four Points by Sheraton
CityCatania
CountryItaly

External IDs

Scopus 85191192656
ORCID /0000-0002-0757-3325/work/165062964
ORCID /0000-0001-9720-0727/work/192581589

Keywords

Keywords

  • Analytical models, Creep, Force, Micromechanical devices, Temperature distribution, Temperature measurement, Thermomechanical processes