Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices
Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Contributors
Abstract
In order to build high performance 3D-Opto-mechatronic integrated device packages, we demonstrate the direct stereolithographic printing of polymeric resins onto ceramic substrate. The effects of adhesion are examined, the lower size limit for structures is found and the adhesion strength is measured. With the results a suitable combination of materials can be chosen for creating a hybrid package for a 3D-Opto-mechatronic integrated device. A prototype of an optical coupler is printed successfully and shows one possible application.
Details
| Original language | English |
|---|---|
| Title of host publication | 2019 42nd International Spring Seminar on Electronics Technology (ISSE) |
| Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| Pages | 1-6 |
| Number of pages | 6 |
| ISBN (print) | 978-1-7281-1875-8 |
| Publication status | Published - 19 May 2019 |
| Peer-reviewed | Yes |
Publication series
| Series | International Spring Seminar on Electronics Technology (ISSE) |
|---|---|
| ISSN | 2161-2528 |
Conference
| Title | 2019 42nd International Spring Seminar on Electronics Technology |
|---|---|
| Abbreviated title | ISSE 2019 |
| Conference number | 42 |
| Duration | 15 - 19 May 2019 |
| City | Wroclaw |
| Country | Poland |
External IDs
| Scopus | 85072283148 |
|---|---|
| ORCID | /0000-0002-0757-3325/work/139064881 |
Keywords
Keywords
- Resins, Adhesives, Polymers, Ceramics, Printing, Substrates, Surface topography