Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionContributedpeer-review

Contributors

Abstract

In order to build high performance 3D-Opto-mechatronic integrated device packages, we demonstrate the direct stereolithographic printing of polymeric resins onto ceramic substrate. The effects of adhesion are examined, the lower size limit for structures is found and the adhesion strength is measured. With the results a suitable combination of materials can be chosen for creating a hybrid package for a 3D-Opto-mechatronic integrated device. A prototype of an optical coupler is printed successfully and shows one possible application.

Details

Original languageEnglish
Title of host publication2019 42nd International Spring Seminar on Electronics Technology (ISSE)
PublisherIEEE
Pages1-6
Number of pages6
ISBN (print)978-1-7281-1875-8
Publication statusPublished - 19 May 2019
Peer-reviewedYes

Publication series

SeriesInternational Spring Seminar on Electronics Technology (ISSE)
ISSN2161-2528

Conference

Title2019 42nd International Spring Seminar on Electronics Technology
Abbreviated titleISSE 2019
Conference number42
Duration15 - 19 May 2019
CityWroclaw
CountryPoland

External IDs

Scopus 85072283148
ORCID /0000-0002-0757-3325/work/139064881

Keywords

Keywords

  • Resins, Adhesives, Polymers, Ceramics, Printing, Substrates, Surface topography