Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
In order to build high performance 3D-Opto-mechatronic integrated device packages, we demonstrate the direct stereolithographic printing of polymeric resins onto ceramic substrate. The effects of adhesion are examined, the lower size limit for structures is found and the adhesion strength is measured. With the results a suitable combination of materials can be chosen for creating a hybrid package for a 3D-Opto-mechatronic integrated device. A prototype of an optical coupler is printed successfully and shows one possible application.
Details
| Originalsprache | Englisch |
|---|---|
| Titel | 2019 42nd International Spring Seminar on Electronics Technology (ISSE) |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers (IEEE) |
| Seiten | 1-6 |
| Seitenumfang | 6 |
| ISBN (Print) | 978-1-7281-1875-8 |
| Publikationsstatus | Veröffentlicht - 19 Mai 2019 |
| Peer-Review-Status | Ja |
Publikationsreihe
| Reihe | International Spring Seminar on Electronics Technology (ISSE) |
|---|---|
| ISSN | 2161-2528 |
Konferenz
| Titel | 2019 42nd International Spring Seminar on Electronics Technology |
|---|---|
| Kurztitel | ISSE 2019 |
| Veranstaltungsnummer | 42 |
| Dauer | 15 - 19 Mai 2019 |
| Stadt | Wroclaw |
| Land | Polen |
Externe IDs
| Scopus | 85072283148 |
|---|---|
| ORCID | /0000-0002-0757-3325/work/139064881 |
Schlagworte
Schlagwörter
- Resins, Adhesives, Polymers, Ceramics, Printing, Substrates, Surface topography