Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Abstract

In order to build high performance 3D-Opto-mechatronic integrated device packages, we demonstrate the direct stereolithographic printing of polymeric resins onto ceramic substrate. The effects of adhesion are examined, the lower size limit for structures is found and the adhesion strength is measured. With the results a suitable combination of materials can be chosen for creating a hybrid package for a 3D-Opto-mechatronic integrated device. A prototype of an optical coupler is printed successfully and shows one possible application.

Details

OriginalspracheEnglisch
Titel2019 42nd International Spring Seminar on Electronics Technology (ISSE)
Herausgeber (Verlag)IEEE
Seiten1-6
Seitenumfang6
ISBN (Print)978-1-7281-1875-8
PublikationsstatusVeröffentlicht - 19 Mai 2019
Peer-Review-StatusJa

Publikationsreihe

ReiheInternational Spring Seminar on Electronics Technology (ISSE)
ISSN2161-2528

Konferenz

Titel2019 42nd International Spring Seminar on Electronics Technology
KurztitelISSE 2019
Veranstaltungsnummer42
Dauer15 - 19 Mai 2019
StadtWroclaw
LandPolen

Externe IDs

Scopus 85072283148
ORCID /0000-0002-0757-3325/work/139064881

Schlagworte

Schlagwörter

  • Resins, Adhesives, Polymers, Ceramics, Printing, Substrates, Surface topography