Characterization of self-assembled monolayers for CueCu bonding technology

Research output: Contribution to journal › Research article › Contributed › peer-review

Contributors

Maria Lykova - , Chair of Electronic Packaging Technology (Author)
Enrico Langer - , Chair of Microsystems (Author)
K. Hinrichs - , Leibniz-Institut für Analytische Wissenschaften - ISAS (Author)
Juliana Panchenko - , Chair of Electronic Packaging Technology (Author)
Jörg Meyer - , Chair of Electronic Packaging Technology (Author)
Ulrich Künzelmann - , Chair of Nanoelectronics (Author)
M Jürgen Wolf - , Fraunhofer Institute for Reliability and Microintegration (Author)
K. D. Lang - , Fraunhofer Institute for Reliability and Microintegration (Author)

Original language	English
Pages (from-to)	19-24
Number of pages	6
Journal	Microelectronic Engineering
Volume	202
Publication status	Published - 16 Oct 2018
Peer-reviewed	Yes

Scopus	85055559481
ORCID	/0000-0001-8576-7611/work/165877178

Self-assembled monolayer, Infrared spectroscopic ellipsometry, IRSE, XPS, Cu-Cu bonding, Cu passivation