Characterization of self-assembled monolayers for CueCu bonding technology

Research output: Contribution to journal › Research article › Contributed › peer-review

Contributors

M. Lykova - (Author)
E. Langer - , Chair of Microsystems, Institute of Semiconductors and Microsystems (Author)
K. Hinrichs - (Author)
I. Panschenko - (Author)
J. Meyer - (Author)
U. Künzelmann - (Author)
M.J. Wolf - (Author)
K.D. Lang - (Author)

Original language	English
Pages (from-to)	19-24
Number of pages	6
Journal	Microelectronic Engineering
Volume	202
Publication status	Published - 2018
Peer-reviewed	Yes

Scopus	85055559481

Self-assembled monolayer, Infrared spectroscopic ellipsometry, IRSE, XPS, Cu-Cu bonding, Cu passivation