Characterization of a Specific Solidification Phenomenon Found in SnAg3Cu0.5 Solder Spheres

Research output: Contribution to book/Conference proceedings/Anthology/Report › Chapter in book/Anthology/Report › Contributed

Contributors

Details

Original languageEnglish
Title of host publicationSmart Systems Integration and Reliability
EditorsBernd Michel, Klaus-Dieter Lang
PublisherGoldenbogen-Verl.
Pages516-525
Number of pages9
ISBN (print)978-3-932434-77-8
Publication statusPublished - 2010
Peer-reviewedNo