Bond Strength Comparison of Commercial and Custom Copper Sinter Pastes under Sinter Process Modifications
Research output: Contribution to conferences › Paper › Contributed › peer-review
Contributors
Details
| Original language | English |
|---|---|
| Pages | 657-662 |
| Number of pages | 6 |
| Publication status | Published - Dec 2024 |
| Peer-reviewed | Yes |
Conference
| Title | 26th Electronics Packaging Technology Conference |
|---|---|
| Abbreviated title | EPTC 2024 |
| Conference number | 26 |
| Duration | 3 - 5 December 2024 |
| Website | |
| Degree of recognition | International event |
| Location | Grand Copthorne Waterfront Hotel Singapore |
| City | Singapore |
| Country | Singapore |
External IDs
| ORCID | /0000-0002-0757-3325/work/177360253 |
|---|---|
| ORCID | /0000-0001-9720-0727/work/192581607 |