Analysis of Electronic Modules for Construction Machines and Development of a Reliability Test Method

Research output: Contribution to book/conference proceedings/anthology/reportConference contributionContributedpeer-review

Contributors

Abstract

This research aims for the assessment of electronic modules for construction machine applications. This work shows the development of a reliability test using vibration loads for modules and components considering their packaging technologies. Exemplarily, an IoT-module was analyzed and will provide an up-to-date view on components and integration technologies. Components and packaging technologies that are considered being critical for thermo-mechanical reliability were selected. Test boards were then designed to allow a comparison between components, variability of component size (e.g., BGA or QFP) and enabling high stress levels. The design process was assisted by FE simulations. Test board vibration behavior from simulation and experiments has been analyzed and compared. It was concluded that the developed test setup and test board can be deployed for harmonic sine tests covering loads that are common for construction machines.

Details

Original languageGerman
Title of host publication2024 47th International Spring Seminar on Electronics Technology (ISSE)
PublisherIEEE
Pages1-5
Number of pages5
Volume2024
ISBN (electronic)9798350385472
ISBN (print)979-8-3503-8548-9
Publication statusPublished - 19 May 2024
Peer-reviewedYes

Conference

Title2024 47th International Spring Seminar on Electronics Technology (ISSE)
Duration15 - 19 May 2024
LocationPrague, Czech Republic

External IDs

ORCID /0000-0002-0757-3325/work/165062967
Scopus 85200492015

Keywords

Keywords

  • Harmonic analysis, Iron, Packaging, Reliability, Seminars, Thermomechanical processes, Vibrations