This research aims for the assessment of electronic modules for construction machine applications. This work shows the development of a reliability test using vibration loads for modules and components considering their packaging technologies. Exemplarily, an IoT-module was analyzed and will provide an up-to-date view on components and integration technologies. Components and packaging technologies that are considered being critical for thermo-mechanical reliability were selected. Test boards were then designed to allow a comparison between components, variability of component size (e.g., BGA or QFP) and enabling high stress levels. The design process was assisted by FE simulations. Test board vibration behavior from simulation and experiments has been analyzed and compared. It was concluded that the developed test setup and test board can be deployed for harmonic sine tests covering loads that are common for construction machines.