Aiming for the reduction of simulation time and time for accelerated testing of solder interconnects, temperature cycle tests with different profiles were simulated. It was found that the simulation of three temperature cycles provides sufficient results for lifetime prognosis of assemblies. Furthermore, as well dwell times as ramp times of thermal conditions are influential on the test results. To achieve precise simulation results, material models need to be examined with respect to the use case and simulation requirements, which should be done later on, to prevent this source of miscalculation in reliability analysis.