Temporary Bonding: Electrostatic

Research output: Contribution to book/Conference proceedings/Anthology/Report › Chapter in book/Anthology/Report › Invited › peer-review

Contributors

  • Christof Landesberger - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Armin Klumpp - , Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)
  • Karlheinz Bock - , Chair of Electronic Packaging Technology, Fraunhofer Research Institution for Microsystems and Solid State Technologies (EMFT) (Author)

Details

Original languageEnglish
Title of host publicationHandbook of Wafer Bonding
PublisherWiley-VCH
Pages367-384
Number of pages18
ISBN (print)9783527326464
Publication statusPublished - 8 Feb 2012
Peer-reviewedYes

External IDs

ORCID /0000-0002-0757-3325/work/139064945

Keywords

ASJC Scopus subject areas

Keywords

  • Clamping force, Dielectric layer, Electrostatic force, Flexible substrates, Johnsen-Rahbek effect, Leakage current, Mobile electrostatic carrier, Thin wafer handling, Through-silicon via (TSV), Unipolar and bipolar chucking