The combination of hybrid interconnection technology on ceramic as a carrier for the RF-electronics with excellent heat management and stereolithographic printing for 3D structures is a novel approach to achieve 3D-Opto-MID parts and, furthermore, to include mechanical properties. By directly printing polymers onto aluminum-oxide substrate (including an electrical circuit), brings together the advantages of both technologies. Using additive manufacturing makes this process suitable for small- to mid-scale productions with a very high design freedom. To analyze the adhesion between Al2O3 substrate and printed polymers, we compare six different resins according to the minimal structure length and the adhesion on the substrate. A longer exposure time of the first layer (burn-in time) leads to sufficient adhesion of the print on the ceramic substrate. To realize smaller adherent structures, longer burn-in times are needed. In a shear test, the forces to lift off the prints from the substrate are measured. The experiments reveal correlation between shear force and contact area with little variance. Based on this evaluation, choosing materials for future applications is easier and design rules can be determined. Furthermore, we present the application of flexible optical waveguides onto the 3D substrate (which will be directly printed in the future), as well as the passive alignment of laser and photodiode in this article. In a first test, we were able to prove the functionality of the 3D-Opto-MID package by launching the waveguide with the applied laser and measuring the current at the photodiode.