Solidification Behavior of Lead-Free SnAgCu Alloys

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionContributed

Contributors

Abstract

The paper reports about influences of cooling rate, alloy composition and thermal storage on the microstructure of Lead-Free SnAgCu alloys. Three different SnAgCu solders were solidified with rates from 0.35 K/min to 37.4 K/min. The microstructure of these bulk specimens show that size and number of intermetallics depend on solidification conditions. The influence of solder composition was investigated by varying the Ag and Cu content. It will be shown how to prevent the formation of large intermetallics by changing process parameters. In addition this paper will present effects of thermal aging, like Ostwald ripening and the coarsening of the microstructure, on two alloys stored at 125degC, for 0.05 h to 500 h.

Details

Original languageEnglish
Title of host publication2006 29th International Spring Seminar on Electronics Technology
PublisherIEEE
Pages32-37
Number of pages6
ISBN (print)1-4244-0551-3
Publication statusPublished - 14 May 2006
Peer-reviewedNo

Conference

Title2006 29th International Spring Seminar on Electronics Technology
Duration10 - 14 May 2006
LocationSt. Marienthal, Germany

External IDs

Scopus 46449134224

Keywords

Keywords

  • Environmentally friendly manufacturing techniques, Lead, Cooling, Microstructure, Intermetallic, Testing, Heating, Tin, Temperature control, Metallization