SoC compatible 1 T1 C FeRAM memory array based on ferroelectric Hf0.5Zr0.5O2

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionContributedpeer-review

Contributors

  • Jun Okuno - , Sony Group Corporation (Author)
  • Takafumi Kunihiro - , Sony Group Corporation (Author)
  • Kenta Konishi - , Sony Group Corporation (Author)
  • Hideki Maemura - , Sony Group Corporation (Author)
  • Yusuke Shute - , Sony Group Corporation (Author)
  • Fumitaka Sugaya - , Sony Group Corporation (Author)
  • Monica Materano - , Chair of Nanoelectronics, TUD Dresden University of Technology (Author)
  • Tarek Ali - , Fraunhofer Institute for Photonic Microsystems (Author)
  • Kati Kuehnel - , Fraunhofer Institute for Photonic Microsystems (Author)
  • Konrad Seide - , Fraunhofer Institute for Photonic Microsystems (Author)
  • Uwe Schroeder - , TUD Dresden University of Technology (Author)
  • Thomas Mikolajick - , Chair of Nanoelectronics, TUD Dresden University of Technology (Author)
  • Masanori Tsukamoto - , Sony Group Corporation (Author)
  • Taku Umebayashi - , Sony Group Corporation (Author)

Abstract

This paper experimentally demonstrates fundamental memory array operation of a ferroelectric HfO2-based 1 T1 C FeRAM. Metal/ferroelectric/metal (MFM) capacitors consisting of a TiN/ Hf0.5Zr0.5O2(HZO)/TiN stack were optimized for a sub 500°C process. Structures revealed excellent performance such as remanent polarization 2Pr > 4\vert uC/cm2, endurance> 1011 cycles, and 10 years data retention at 85°C. Furthermore, the MFM capacitors were successfully integrated into a 64 kbit 1T1C FeRAM array including our dedicated circuit for array operation. Back-end-of-line (BEOL) wiring showed no degradation of the underlying CMOS logic. Program and read operation were properly controlled resulting in 100 % bit functionality at an operation voltage of2.5 Vand operating speed at 14 ns. This technology matches requirements of last level cash (LLC) and embedded non-volatile-memory (NVM) in low power System-on-a-Chip (SoC) for IoT applications.

Details

Original languageEnglish
Title of host publication2020 IEEE Symposium on VLSI Technology
Place of PublicationHonolulu
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
ISBN (electronic)978-1-7281-6460-1
ISBN (print)978-1-7281-6461-8
Publication statusPublished - Jun 2020
Peer-reviewedYes

Publication series

SeriesSymposium on VLSI Technology
Volume2020-June
ISSN0743-1562

Conference

Title2020 IEEE Symposium on VLSI Technology, VLSI Technology 2020
Duration16 - 19 June 2020
CityHonolulu
CountryUnited States of America

External IDs

ORCID /0000-0003-3814-0378/work/142256192

Keywords

ASJC Scopus subject areas

Keywords

  • capacitor, hafnium oxide, zirconium oxide