SoC compatible 1 T1 C FeRAM memory array based on ferroelectric Hf0.5Zr0.5O2
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
This paper experimentally demonstrates fundamental memory array operation of a ferroelectric HfO2-based 1 T1 C FeRAM. Metal/ferroelectric/metal (MFM) capacitors consisting of a TiN/ Hf0.5Zr0.5O2(HZO)/TiN stack were optimized for a sub 500°C process. Structures revealed excellent performance such as remanent polarization 2Pr > 4\vert uC/cm2, endurance> 1011 cycles, and 10 years data retention at 85°C. Furthermore, the MFM capacitors were successfully integrated into a 64 kbit 1T1C FeRAM array including our dedicated circuit for array operation. Back-end-of-line (BEOL) wiring showed no degradation of the underlying CMOS logic. Program and read operation were properly controlled resulting in 100 % bit functionality at an operation voltage of2.5 Vand operating speed at 14 ns. This technology matches requirements of last level cash (LLC) and embedded non-volatile-memory (NVM) in low power System-on-a-Chip (SoC) for IoT applications.
Details
| Originalsprache | Englisch |
|---|---|
| Titel | 2020 IEEE Symposium on VLSI Technology |
| Erscheinungsort | Honolulu |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers (IEEE) |
| ISBN (elektronisch) | 978-1-7281-6460-1 |
| ISBN (Print) | 978-1-7281-6461-8 |
| Publikationsstatus | Veröffentlicht - Juni 2020 |
| Peer-Review-Status | Ja |
Publikationsreihe
| Reihe | Symposium on VLSI Technology |
|---|---|
| Band | 2020-June |
| ISSN | 0743-1562 |
Konferenz
| Titel | 2020 IEEE Symposium on VLSI Technology, VLSI Technology 2020 |
|---|---|
| Dauer | 16 - 19 Juni 2020 |
| Stadt | Honolulu |
| Land | USA/Vereinigte Staaten |
Externe IDs
| ORCID | /0000-0003-3814-0378/work/142256192 |
|---|
Schlagworte
ASJC Scopus Sachgebiete
Schlagwörter
- capacitor, hafnium oxide, zirconium oxide