Scaling Effects for Miniaturized Solder Interconnects in Electronic Packages
Research output: Contribution to book/conference proceedings/anthology/report › Chapter in book/anthology/report › Contributed › peer-review
Contributors
Abstract
This chapter gives an overview about solder interconnects in electronic packages and their important influence on reliability. The future demands for higher pin counts in electronic components caused by the fast pace of miniaturisation in the semiconductor process, pose new challenges for solder interconnects. It will be shown that miniaturization of solder volume has a strong influence on microstructure. Changes of the mechanical behaviour will be presented and the influence on reliability will be discussed.
Details
| Original language | English |
|---|---|
| Title of host publication | Bio and Nano Packaging Techniques for Electron Devices: Advances in Electronic Device Packaging |
| Editors | Gerald Gerlach, Klaus-Jürgen Wolter |
| Place of Publication | Berlin, Heidelberg |
| Publisher | Springer, Berlin, Heidelberg |
| Pages | 525-537 |
| Number of pages | 13 |
| ISBN (print) | 978-3-642-28522-6 |
| Publication status | Published - 17 Jul 2012 |
| Peer-reviewed | Yes |
External IDs
| RIS | Müller2012 |
|---|---|
| Scopus | 84949177641 |