The emergence of modern driving assistance systems, traffic regulations and autonomous driving make the use novel materials and concepts for electronics packaging for high frequency and harsh environment use conditions necessary. These materials come with different material thermo-mechanical properties compared to the established materials which influence the deformation behaviour of packages and assemblies and thus can affect the failure behaviour of board level solder joints under thermal load. For example, different Young's moduli and coefficients of thermal expansion have to be considered for their impact on the package reliability. In this study a board level reliability test of a large BGA-package supported by sidefill is performed. The influence of temperature cycling from -40 °C to +125 °C for up to 3,000 cycles is investigated. A commercially available sidefill material with comparably low CTE and suitable high $\boldsymbol{T}_{\mathbf{g}}$ and Young's modulus is selected to meet both automotive and high frequency package requirements. Considering the different material properties and the large package dimension (30 x 12 mm2), temperature changes will cause severe stress to the board level solder interconnects (alloy SAC305, diameter 600 μm). The performance of a test module in terms of the solder joint damage behaviour under temperature cycling will be analysed in this study. Electrical measurements and microsections were made.