The development of novel packages for high frequency applications and harsh environment use conditions requires a detailed reliability assessment. The mechanical and thermal properties of the used packaging materials can differ significantly. E. g. different Young's moduli and coefficients of thermal expansion can cause deformation, warpage, and failures of solder joints under thermal load conditions. In this study, a board level reliability study of a mmWave test module is performed. The influence of temperature shock cycling from - 55 °C to + 150 °C for up to 750 cycles is investigated. Electrical measurements and Shadow Moiré measurements are performed. A correlation between failed solder joints and the warpage behavior of the investigated test assembly are assessed.